Wire Bonders

INSULATED WIRE BONDING SYSTEMS OPERATING PRINCIPALS
The bond is typically a gold-to-gold or aluminum to aluminum molecular weld. The wire is held to the pad by tool pressure and is scrubbed by ultrasonic vibration. The insulation is broken open at the contact line and underneath so the bond can be made by an operator using an X-Y-Z manipulator.

Model 260

2 phase cycle creating a specific bond profile over time. Each phase ideally suited for a specific application (e.g. insulation vs. wire). Bond force and power can be programmed to increase or decrease during a bond cycle. Nonvolatile memory stores up to 100 unique and specific job files for simple operator recall. Designed to meet the needs of maximum flexibility and capability within a single unit. Membrane alphanumeric key pad with LCD display screen. Operator access restricted from job parameter file. Smooth 8:1 ratio hand manipulator assembly. Accepts most industry standard stero-zoom microscope mount brackets. Photocell detector technology used in power firing sequence.

Model 251 TAB Bonder

Single ultrasonic power cycle. Bond force set manually via spring. Power and time set via potentiometers on front of system. Designed to meet the needs of maximum flexibility at the lowest cost. Ultra smooth 8:1 ratio hand manipulator assembly. Accepts most industry standard sterozoom microscope mount brackets. Superior electronic photocell detector technology used in power firing sequence.

Model 255 Bonder

Single phase ultrasonic bonding cycle. Bond power and time can be programmed via membrane keypad and display screen. Nonvolatile memory storage of the specific job file for simple recall. Designed to meet the needs of maximum flexibility and capability. Multi level password protection. Operator access restricted from job parameter file. Bond parameters can only be adjusted to within +/- 10% of source file parameters. Smooth 8:1 ratio hand manipulator assembly. Photocell detector technology used in power firing sequence.